AG15PC152FS-K2M [TAIYO YUDEN]
Varistor, Through Hole Mount, RADIAL LEADED;
| 型号： | AG15PC152FS-K2M |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Varistor, Through Hole Mount, RADIAL LEADED |
| 文件： | 总7页 (文件大小：625K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
スパークギャップ
SPARK GAPS
OPERATING TEMP.
ー30～＋85℃
特長ꢀFEATURES
・自己消火性樹脂を用い、安全性が高い
・もれ電流が極めて小さい
・静電容量が極めて小さい
・Very safe due to self-extinguishing resin
・Leakage current is very small.
・Electrostatic capacitance is very small.
用途ꢀAPPLICATIONS
・CRT周
辺の異
常電圧吸収
・Used to absorb abnormal voltages in the periphery of a CRT
形名表記法ꢀORDERING CODE
8
4
1
6
リード形状［mm］
被覆状態
放電電圧許容差［V］
形式
形状
間隔
5.0
5.0
6.4
6.4
径
長さ
AG
スパークギャップ
△
樹脂キャップなし
樹脂キャップ付
△＝スペース
F
±500
±800
K2M
K2U
K4M
K4U
Kフォーミング
Kフォーミング
Kフォーミング
Kフォーミング
0.60
0.60
0.60
0.60
20以上
5.0±1
20以上
5.0±1
C
G
2
外径形状
15
5
7
外形寸法毎の各タイプ
公称放電開始電圧［VDC］
122
252
包装
Sー
1200
2500
15タイプ単品
15タイプテーピング品
（袋詰め）
Bー
3
△＝スペース
樹脂材料
P
アルキド樹脂
A G
1 5 P C 1 2 2 F S ー K 2 M
1
2
5
7
8
6
3
4
6
1
4
8
Type
AG
Discharge voltage
Coating conditions
Lead configuration［mm］
Lead type
K-formed
K-formed
K-formed
K-formed
Lead space
Diameter
Length
20Min.
5.0±1
20Min.
5.0±1
△
without resin cap
Spark gaps
Tolerance［V］
K2M
K2U
K4M
K4U
5.0
5.0
6.4
6.4
0.60
0.60
0.60
0.60
C
with resin cap
F
G
±500
±800
2
△＝Blank space
External dimension
5
7
6
Type by external dimen-
sion
15
Nominal discharge
Packaging
Sー
Type 15, bulk
starting
122
252
voltage［VDC］
3
Bー
Type 15, taped
1200
2500
△＝Blank space
Resin material
P
Alkyd resin
472
外形寸法ꢀEXTERNAL DIMENSIONS
Type
AG15
Kフォーミング Formed
K2M,K2U,K4M,K4U
リード線
Lead type
キ
ャップレス
本体の厚
さ
Thickness of body：3.5max
8
（0.138max）
キ
ャップ
付
き
本体の厚
さ
Thickness of body：4±0.5
（0.157±0.020）
Unit：mm（inch）
アイテム一覧ꢀPART NUMBERSꢀ
放電開始電圧
Discharge starting voltage（DC）
絶縁抵抗
Insulation
resistance
［MΩ］＊1
EHS
形ꢀ式
Type
（Environmental
Hazardous
リード形状
Lead configuration
公称値
許容差
Tolerance［V］
± 500
Nominal value［V］
1200ꢀ1500ꢀ2000
2500
Substances）
AG15P□◯◯◯◇☆ー▽▽▽
RoHS
Kフォーミング K Formed
10000min
± 800
形名の□には被覆状態、◯には放電開始電圧、◇には許容差、☆には包装、▽にはリード形状記号が入ります。
□Please specify the coating condition code and ○ the discharge starting voltage code and ◇ the tolerance code and ☆ the packaging code and ▽ the
lead configuration code.
（注）使用している材料は自己消火性樹脂で、UL94V-0、UL1410（phase ll 規制）を保証するものです。
Note：The material used is a self-extinguishing resin conforming to UL94V-0 and UL1410（phase ll regulation）
ꢀꢀꢀ＊1 AG15はDC500V20秒以内の値 です。
＊1 Values of AG15 are set at DC500V within 20 seconds.
セレクションガイド
アイテム一覧
特性図
梱包
信
頼性
使用上の注意
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.14
P.473
P.474
P.475
P.476
P.478
etc
473
特性図ꢀELECTRICAL CHARACTERISTICS
474
梱包ꢀPACKAGING
最小受注単位数 Minimum Quantity
最小受注単位数 Minimum Quantity［pcs］
Type
テーピング Taped
1300※
袋詰め Bulk
1000
AG15
※K2Mタイプのみ
※Available for K2M type only
テーピング寸法ꢀ（K2Mタイプ）ꢀTaping Dimensions（K2M Type）
8
寸法
記号
Dimensions
Symbol
6.8±0.5（0.268±0.020）
7.0±0.5（0.276±0.020）
4.0±0.5（0.157±0.020）
12.7±1.0（0.500±0.039）
12.7±0.3（0.500±0.012）
3.85±0.5（0.152±0.020）
6.35±1.3（0.250±0.051）
5.0±0.5（0.197±0.020）
A
B
T
P
0
P
1
P
2
P
F
＋1.0
ー0.5
＋0.039
ー0.020
18.0
（0.709
） ꢀ
W
0
12.0min （0.472min）
W
＋0.030
9.0 ー＋0.75 （0.354
）
1
W
ー 0.020
0.5
2
W
3.0max （0.118max）
19.6±0.5（0.772±0.020）
16.0±0.5（0.630±0.020）
4.0±0.3（0.157±0.012）
11.0max （0.433max）
H
0
H
0
φD
L
ℓ
2.0max （0.079max）
0.75±0.2（0.030±0.008）
t
△h1
△h2
d
2.0max （0.079max）
0.6±0.05（0.024±0.002）
Unit：mm（inch）
475
RELIABILITY DATA
SPARK GAPS
Item
Specified Value
Test Methods and Remarks
1.Operating Temperature
Range
ー30℃～＋85℃
2.Operating Humidity Range
95%RH max.（No dew condensation）
ー40℃～＋85℃
3.Storage Temperature
ꢀRange
4.Discharge Voltage
Within the specified tolerance
10,000 MΩ min.
With the Circuit 1 shown below, conduct measurement
with voltage application.
5.Insulation Resistance
6.Capacitance
Applied voltage：500VDC
Duration：Within 20 sec.
1pFmax.
Measuring frequency：1±0.1MHz
Measuring voltage：0.5～5.0Vrms
Bias application：None
8
With the Circuit 2 shown below, repeat discharge with
specified voltage, followed by the measurement within
2 to 5 hrs.
7.Discharge
Discharge
ꢀLife
＋20
％
Voltage
ー35
Change
Number of discharge：10,000 times
Insulation
5000MΩ
Resistance
Temperature：40±2℃
8.Damp Heat
Discharge
Humidity：90～95％RH
＋50
％
Voltage
Change
ー30
Duration：250 hrs
Recovery：2 to 5 hrs of recovery under the standard
condition after the removal from test chamber.
Insulation
Resistance
5000MΩ
9.Terminal
No damage
Apply the tensile force in the direction to draw terminal.
ꢀStrength
Applied force：9.8N
Tensile
Apply the bending force to incline the body to right and left
through angle of 90°
Applied force：4.9N
No damage
Torsional
Circuit 1
Circuit 2
AG15
AG15
R：20MΩ
C：2000pF
R：20MΩ
C：10000pF
E：Refer to individual specification
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
477
PRECAUTIONS
1/2
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
1. Circuit Design
◆Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear reac-
tors, etc. may cause serious harm to human life or have severe
social ramifications. As such, any Spark Gaps to be used in
such equipment may require higher safety and/or reliability
considerations and should be clearly differentiated from com-
ponents used in general purpose applications.
◆Verification of Rated voltage（DC rated voltage）
1. Spark Gaps has determined electric discharge voltage be-
tween metaled Electrode using the insulation resistance of air.
Therefore, since a life changes with the energies of input serge,
please give me examination enough in the case of use.
2. Since between the Electrode will be in a short state at the time
of electric discharge, when using it for a low impedance circuit,
the Follow Current occurs and reduce the life of Spark Gaps
remarkably. In such a case, please connect low resistance or a
capacitive varistor in series.
8
3. Since the voltage which starts electric discharge when the
early serge of a standup is actually impressed, since electric
discharge delay generates Spark Gaps may become higher
than the specified electric discharge start voltage, cautions are
required.
4. Since Spark Gaps was developed for serge with small energy,
when using it as an object for guidance thunder absorption
with the big energy generated on a commercial power supply
line, telephone / communication line, etc., it requires cautions
enough.
◆Operating Environment precautions
1. Spark Gaps should not be used in the following environments:
（1）Environmental conditions to avoid
a. exposure to water or salt water.
b. exposure to moisture or condensation.
c. exposure to corrosive gases（such as hydrogen sulfide, sulfu-
rous acid, chlorine, and ammonia）
2. PCB Design
1. When Spark Gaps are mounted onto a PC board, hole dimen-
sions on the board should match the lead pitch of the compo-
nent, if not it will cause breakage of the terminals or cracking
of terminal roots covered with resin as excess stress travels
through the terminal legs. As a result, humidity resistance
performance would be lost and may lead to a reduction in
insulation resistance and cause a withstand voltage failure.
3. Considerations for automatic
◆Adjustment Automatic Insertion machines（leaded components）
1. When inserting Spark Gaps in a PC board by auto-insertion
machines the impact load imposed on the capacitors should
be minimized to prevent the leads from chucking or clinching.
insertion
479
PRECAUTIONS
2/2
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
4. Soldering
◆Selection of Flux
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To minimize
the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance（Chlorine, etc.）content is used to activate the
flux, an excessive amount of residue after soldering may lead to corrosion of the terminal
electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degradation
of insulation resistance and therefore affect the reliability of the components. The clean-
ing methods and the capability of the machines used should also be considered carefully
when selecting water-soluble flux.
1. When soldering Spark Gaps on the board, flux should be
applied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt%
（equivalent to Chroline）of halogenated content. Flux hav-
ing a strong acidity content should not be applied.
3. When using water-soluble flux, special care should be taken
to properly clean the boards.
◆Wave Soldering
1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses
may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the
Spark Gaps.
1.Temperature, time, amount of solder, etc. are specified inꢀ
accordance with the following recommended conditions.
2. Do not immerse the entire Spark Gaps in the flux during the
soldering operation. Only solder the lead wires on the bot-
tom of the board.
8
5. Cleaning
◆Board cleaning
1. The resin material used for the outer coating of capacitors is occasionally a wax sub-
stance for moisture resistance which can easily be dissolved by some solutions. So
before cleaning, special care should be taken to test the component’s vulnerability to
the solutions used.
1. When cleaning the mounted PC boards, make sure that cleaning
conditions are consistent with prescribed usage conditions.
When using water-soluble flux please clean the PCB with purified water sufficiently
and dry thoroughly at the end of the process. Insufficient washing or drying could
lower the reliability of the capacitors.
6. Post-cleaning-process
◆Application of resin molding, etc. to the PCB and compo-
nents.
1-1. The thermal expansion and coefficient of contraction of the molded resin are not nec-
essarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to
stresses due to thermal expansion and contraction during and after hardening. This may
lower the specified characteristics and insulation resistance or cause reduced withstand
voltage by cracking the ceramic or separating the coated resin from the ceramics.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may
remain inside the resin during the hardening period or while left under normal conditions,
causing a deterioration of the capacitor's performance.
1. Please contact your local Taiyo Yuden sales office before
performing resin coating or molding on mounted capacitors.
Please verify on the actual application that the coating pro-
cess will not adversely affect the component quality.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the con-
tents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the
mold resins is higher than the operating temperature of the Spark Gaps.
7. Handling
◆Mechanical considerations
1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the
board may damage or crack the Spark Gaps.
1. Be careful not to subject the Spark Gaps to excessive me-
chanical shocks. Withstanding voltage failure may result.
2. If Spark Gaps are dropped onto the floor or a hard surface
they should not be used.
2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects
and have a higher risk of failure over time.
8. Storage conditions
◆Storage
1. Under high temperature/high humidity conditions, the decrease in solderability due to
the oxidation of terminal electrodes and deterioration of taping and packaging char-
acteristics may be accelerated.
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible. Recom-
mended conditions: Ambient temperature Below 40 ℃ Humid-
ity Below 70% RH. Products should be used within 12 months
after delivery. After the above period, the solderability should
be checked before using the Spark Gaps.
2. Spark Gaps should not be kept in an environment filled with
decomposition gases such as（sulfurous hydrogen, sulfurous
acid, chlorine, ammonia, etc.）
3. Spark Gaps should not be kept in a location where they may
be exposed to moisture, condensation or direct sunlight.
481
相关型号：
AG15PC252F-K2M
RESISTOR, VOLTAGE DEPENDENT, 2500V, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT
TAIYO YUDEN
AG15PC252G-K2U
RESISTOR, VOLTAGE DEPENDENT, 2500V, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT
TAIYO YUDEN
AG15PC252GB-K4U
RESISTOR, VOLTAGE DEPENDENT, 2500V, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT
TAIYO YUDEN
AG1801DI
Datacom Transformer, 10/100/1000 BASE-T Application(s), 1CT:1CT; 1CT:1CT, ROHS COMPLIANT
ALLIED
AG1801DS
Datacom Transformer, 10/100/1000 BASE-T Application(s), 1CT:1CT; 1CT:1CT, ROHS COMPLIANT
ALLIED
AG1802DI
Datacom Transformer, 10/100/1000 BASE-T Application(s), 1CT:1CT; 1CT:1CT, ROHS COMPLIANT
ALLIED
AG1802DS
Datacom Transformer, 10/100/1000 BASE-T Application(s), 1CT:1CT; 1CT:1CT, ROHS COMPLIANT
ALLIED
©2020 ICPDF网 联系我们和版权申明